EIC0910-2 updated 08/21/2007 9.50-10.50ghz 2-watt inter nally-matched power fet specifications are subjec t to change without notice. excelics semiconductor, inc. 310 de guigne drive, sunnyvale, ca 94085 page 1 of 4 phone: 408-737-1711 fax: 408-737-1868 web: www.excelics.com revised october 2007 features ? 9.50 ?10.50ghz bandwidth ? input/output impedance matched to 50 ohms ? +33.5 dbm output power at 1db compression ? 8.0 db power gain at 1db compression ? 30% power added efficiency ? -46 dbc im3 at po = 22.5 dbm scl ? 100% tested for dc, rf, and r th electrical characteristics (t a = 25 c) caution! esd sensitive device. symbol parameters/test conditions 1 min typ max units p 1db output power at 1db compression f = 9.50-10.50ghz v ds = 10 v, i dsq 550ma 32.5 33.5 dbm g 1db gain at 1db compression f = 9.50-10.50ghz v ds = 10 v, i dsq 550ma 7.0 8.0 db ? g gain flatness f = 9.50-10.50ghz v ds = 10 v, i dsq 550ma 0.6 db pae power added efficiency at 1db compression v ds = 10 v, i dsq 550ma f = 9.50-10.50ghz 30 % id 1db drain current at 1db compression f = 9.50-10.50ghz 600 700 ma im3 output 3rd order intermodulation distortion ? f = 10 mhz 2-tone test; pout = 22.5 dbm s.c.l 2 v ds = 10 v, i dsq 65% idss f = 10.50ghz -43 -46 dbc i dss saturated drain current v ds = 3 v, v gs = 0 v 1000 1250 ma v p pinch-off voltage v ds = 3 v, i ds = 10 ma -2.5 -4.0 v r th thermal resistance 3 11 12 o c/w note: 1. tested with 100 ohm gate resistor. 2. s.c.l. = single carrier level. 3. overall rth depends on case mounting. absolute maximum rating for efe symbols parameters absolute 1 continuous 2 vds drain-source voltage 15v 10v vgs gate-source voltage -5v -4v igf forward gate current 24ma 7.2ma igr reverse gate current -4.8ma -1.2ma pin input power 33.0dbm @ 3db compression tch channel temperature 175c 175c tstg storage temperature -65c to +175c -65c to +175c pt total power dissipation 12.5w 12.5w note: 1. exceeding any of the above ratings may result in permanent damage. 2. exceeding any of the above ratings may reduce mttf below design goals.
EIC0910-2 updated 08/21/2007 9.50-10.50ghz 2-watt inter nally-matched power fet specifications are subjec t to change without notice. excelics semiconductor, inc. 310 de guigne drive, sunnyvale, ca 94085 page 2 of 4 phone: 408-737-1711 fax: 408-737-1868 web: www.excelics.com revised october 2007 performance data typical s-parameters (t= 25c, 50 ? system, de-embedded to edge of package) v ds = 10 v, i dsq = 550ma 0 1.0 -1.0 1.0 10.0 - 1 0 . 0 1 0 . 0 5.0 - 5 . 0 5 . 0 2.0 - 2 . 0 2 . 0 3.0 - 3 . 0 3 . 0 4.0 - 4 . 0 4 . 0 0.2 - 0 . 2 0 . 2 0.4 - 0 . 4 0 . 4 0.6 - 0 . 6 0 . 6 0.8 - 0 . 8 0 . 8 0 1.0 1.0 -1.0 10.0 1 0 . 0 - 1 0 . 0 5.0 5 . 0 - 5 . 0 2.0 2 . 0 - 2 . 0 3.0 3 . 0 - 3 . 0 4.0 4 . 0 - 4 . 0 0.2 0 . 2 - 0 . 2 0.4 0 . 4 - 0 . 4 0.6 0 . 6 - 0 . 6 0.8 0 . 8 - 0 . 8 s11 and s22 swp max 11ghz swp min 9ghz s[1,1] * EIC0910-2 s[2,2] * EIC0910-2 9 9.5 10 10.5 11 frequency (ghz) s21 and s12 -30 -20 -10 0 10 20 s21 and s12 (db) db(|s[2,1]|) * EIC0910-2 db(|s[1,2]|) * EIC0910-2 freq --- s11 --- --- s21 --- --- s12 --- --- s22 --- (ghz) mag ang mag ang mag ang mag ang 8.75 0.801 -144.750 1.666 55. 890 0.045 10.590 0.698 -25.380 9.00 0.748 -164.560 1.962 36.560 0.059 -9.970 0.658 -39.760 9.25 0.650 171.690 2.305 14.740 0. 076 -32.680 0.600 -57.400 9.50 0.522 141.280 2.669 -10.520 0.098 -58.510 0.516 -79.320 9.75 0.364 101.620 2.943 -38.640 0.117 -86.820 0.405 -107.410 10.00 0.229 42.070 3.009 -67.750 0.130 -115.840 0.288 -144.010 10.25 0.227 -31.690 2.929 -95.78 0 0.134 -143.460 0.223 167.180 10.50 0.309 -80.620 2.712 -122.110 0.132 -168.960 0.232 122.730 10.75 0.369 -111.080 2.470 -146. 280 0.126 168.060 0.276 93.950 11.00 0.399 -134.340 2.254 -168.390 0.123 146.710 0.329 75.830 11.25 0.402 -154.030 2.085 170. 040 0.117 126.180 0.377 62.360
EIC0910-2 updated 08/21/2007 9.50-10.50ghz 2-watt inter nally-matched power fet specifications are subjec t to change without notice. excelics semiconductor, inc. 310 de guigne drive, sunnyvale, ca 94085 page 3 of 4 phone: 408-737-1711 fax: 408-737-1868 web: www.excelics.com revised october 2007 power de-rating curve and im3 definition power dissipation vs. temperature 0 2 4 6 8 10 12 14 0 25 50 75 100 125 150 175 case temperature (c) total power dissipation (w) safe operating region potentially unsafe operating region f1 f2 (2f1-f2) f1 f2 (2f2-f1) im3 pout pin ip 3 = pout + im3/2 third-order intercept point ip3 f1 or f2 (2f2 - f1) or (2f1 - f2) pin [s.c.l.] (dbm) pout [s.c.l.] (dbm) im3 typical power data (v ds = 10 v, i dsq = 550 ma) typical im3 data (v ds = 10 v, i dsq 65% idss ) p-1db & g-1db vs frequency 32.00 33.00 34.00 35.00 36.00 37.00 9.4 9.6 9.8 10.0 10.2 10.4 10.6 frequency (ghz) p-1db (dbm) 5.00 6.00 7.00 8.00 9.00 10.00 g-1db (db) p-1db (dbm) g-1db (db) im3 vs output power f1 = 9.50 ghz, f2 = 9.51 ghz -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 17 18 19 20 21 22 23 24 25 26 27 28 29 30 pout [s.c.l.] (dbm) im3 (dbc ) im3 (dbc)
EIC0910-2 updated 08/21/2007 9.50-10.50ghz 2-watt inter nally-matched power fet specifications are subjec t to change without notice. excelics semiconductor, inc. 310 de guigne drive, sunnyvale, ca 94085 page 4 of 4 phone: 408-737-1711 fax: 408-737-1868 web: www.excelics.com revised october 2007 packages outline dimensions in inches, tolerance + .005 unless otherwise specified EIC0910-2 (hermetic) EIC0910-2nh (non-hermetic) all dimensions in inches excelics yyww sn all dimensions in inches yyww excelics sn caution! esd sensitive device. caution! esd sensitive device. ordering information part number packages grade 1 f test (ghz) p 1db (min) im 3 (min) 2 EIC0910-2 hermetic industrial 9.50-10.50ghz 32.5 -43 EIC0910-2nh non-hermetic industrial 9.50-10.50ghz 32.5 -43 notes: 1. contact factory for military and hi-rel grades. 2. exact test conditions are specified in ?electrical characteristics? table. disclaimer excelics semiconductor reserves the right to m ake changes without further notice to any products herein to improve reliability, function or design. excelics does not assume any liability arising out of the application or use of any product or circuit described herein. life support policy excelics semiconductor products are not authoriz ed for use as critical components in life support devices or systems without the express written approval of excelics semiconductor, inc. as here in: 1. life support devices or systems are devices or system s which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labe ling, can be reasonably expected to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life suppo rt device or system, or to affect its safety or effectiveness EIC0910-2 EIC0910-2nh
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